Electronic Adhesives Selection Guide
Product Code : PAR-5
Product Description
| Grade | Substrates | Viscosity @ 25 °C | Shore Hardness | Elongation | Cure | Tensile | Application |
| 4710 | Metals, Plastics, Ferrite | 17,000 cps | 45D | 90% | UV, Visible or Heat | 1,000 psi | High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application. |
| 4019 | Metals, Plastics, Ferrite | 600 cps | 55D | 72% | UV, Visible or Heat | 750 psi | Specifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing. |
| 4025 | Metals, Ceramic, Glass Filled epoxy | 150 cps | 85D | 12% | UV, Visible and Heat | Clear | Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure. |
| Grade | Substrates | Viscosity @ 25 °C | Shore Hardness | Elongation | Cure | Tensile | Application |
| 4710 | Metals, Plastics, Ferrite | 17,000 cps | 45D | 90% | UV, Visible or Heat | 1,000 psi | High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application. |
| 4019 | Metals, Plastics, Ferrite | 600 cps | 55D | 72% | UV, Visible or Heat | 750 psi | Specifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing. |
| 4025 | Metals, Ceramic, Glass Filled epoxy | 150 cps | 85D | 12% | UV, Visible and Heat | Clear | Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure. |
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