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Electronic Adhesives Selection Guide

Electronic Adhesives Selection Guide
Electronic Adhesives Selection Guide
Product Code : PAR-5
Product Description
Grade Substrates Viscosity @ 25 °C Shore Hardness Elongation Cure Tensile Application
4710 Metals, Plastics, Ferrite 17,000 cps 45D 90% UV, Visible or Heat 1,000 psi High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application.
4019 Metals, Plastics, Ferrite 600 cps 55D 72% UV, Visible or Heat 750 psi Specifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing.
4025 Metals, Ceramic, Glass Filled epoxy 150 cps 85D 12% UV, Visible and Heat Clear Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure.
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